Federal contract
Vorago Technologies Has Produced an Ic Definition and Architecture for a Rad-hard I/o Expansion Chip That Is Capable of Interfacing to Next Generation Spaceflight Processor Devices Including the High-performance Spaceflight Computing (HPSC) Chiplet. We Have Gathered the Best Available Knowledge of HPSC Use-cases to Conceptualize and Articulate the Requirements for an I/o Expansion Chip, Creating an Architecture for an Optimized and Robust Ic That Can Be Implemented to Meet the Requirements of Next.generation Nasa Space Electronics Systems.
Committed
$747,761
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