Electroninks Incorporated

Metal Complex Inks for Low-cost Photovoltaic Material Metallization This Project Will Develop New Screen-printed Reactive Metal Complex Pastes, Invented and Commercialized by Electroninks, Inc. (ei, Austin, TX Usa, Https://electroninks.com), for Photovoltaic Applications to Significantly Lower the Cost of Metallization and Improve Device Efficiencies. the New Pastes Will Do So by: 1) Lowering the Finger Resistivity and Precious Metals Usage by Printing Much Denser (and Therefore Thinner/less Material) Metal Films Than Possible With Traditional Particle-based Screen-printed Pastes; 2) Decreasing the Firing Temperature to Help Preserve Passivation; and 3) Enabling a Path to Move the Tw-scale PV Industry From Ag to Other Materials Including Ni, Cu, and Ni/cu Alloy Pastes While Continuing to Leverage Capital Investment and Expertise in Screen Printing Metallization. the Objective for Budget Period One Is to Develop a Cu-based, Metal-complex Ink With a Minimum Resistivity Appropriate for PV Applications. the Objective for Budget Period Two Is to Test the Cu-based, Metal-complex Inks on Tunnel Oxide Passivated Contact (TOPCON) and Silicon Heterojunction (SHJ or HJT) Solar Cell Surfaces for Contact Resistivity and Reliability.