Federal grant · cooperative agreement (b)
Jetcool Technologies Inc., DE-FOA-0002852(COOLERCHIPS)(SBIR/STTR) New Award Control #: 2852-1525 Project Title: Sub-one Pue Through Silicon Cooling Efficiency Jetcool Technologies Will Improve the Concentration of Heat So That Heat Rejection to Ambient Becomes Less Energy and Resource Intensive, for Example Through Higher Coolant Temperatures and Reduce the Needed Electricity by Improving the Fundamental Efficiency at Which the Compute Devices Run.
Committed
$1.3 Million
Paid out
$943.8K
75%
Committed, not yet paid
$321.9K
25%
Everything here is this single award's whole record — signed, amended, paid — not a fiscal-year slice. The by-year charts elsewhere split an award across the years it was committed; this page keeps it whole.
Committed is what the government has legally promised on this award so far. Contracts can also carry a ceiling — the maximum if every option is exercised. Unspent ceiling is headroom, not money owed.
The cash actually disbursed against this award. The gap from committed is the disbursement pipeline: promised, not yet cashed.
Each transaction is a signing event — an action that created or changed the award, dated the day it was signed — not a payment. Negative amounts are real: money de-committed at closeout or renegotiation.
One bar, the award’s whole arithmetic: paid out, then committed, not yet paid, then .
Loading…