Federal award · other reimbursable, contingent, intangible, or indirect financial assistance

Advanced Research Projects Agency - Energy to

Hpi Federal LLC

HP Federal LLC,2851-1608 DE-FOA-0002851: (coolerchips) New Other Transaction Agreement (OTA) This Other Transaction Agreement (OTA) Is Awarded to Hpi Federal LLC for a Project Entitled, ''embedded Microfluidic Cooling for Nextgen High Power Server Architectures”. This Award Is Being Made in Accordance With Foa Number DE-FOA-0002851 (coolerchips) and Application Control Number 2851-1608.

Committed

$3.2 Million

Paid out
$1.3M
40%
Committed, not yet paid
$1.9M
60%

How to read these numbers

One award, start to finish: Everything here is this single award's whole record — signed, amended, paid — not a fiscal-year slice. The by-year charts elsewhere split an award across the years it was committed; this page keeps it whole.
Committed vs. ceiling: Committed is what the government has legally promised on this award so far. Contracts can also carry a ceiling — the maximum if every option is exercised. Unspent ceiling is headroom, not money owed.
Paid out: The cash actually disbursed against this award. The gap from committed is the disbursement pipeline: promised, not yet cashed.
The ledger: Each transaction is a signing event — an action that created or changed the award, dated the day it was signed — not a payment. Negative amounts are real: money de-committed at closeout or renegotiation.
The money bar: One bar, the award’s whole arithmetic: paid out, then committed, not yet paid, then .

Source

This award on USAspending.gov ↗