Finwave Semiconductor, Inc.

Cambridge Electronics, Inc. CONTROL#2166-1581 Base Award Scaleup Project TITLE:8” 3DGAN Finfet Technology for Energy Efficient Data Centers and 5G Network'' Cambridge Electronics Aims to Create an Ecosystem Around the 3DGAN Technology by Transferring It to a Us-based 8” Si Fab and Forming Partnership With Epi-wafer Vendors, Foundries and Semiconductor Chip and Module Manufacturers for Collaborative Product Development.

Committed

$5.0 Million

Paid out
$5.0M
99%
Committed, not yet paid
$48.9K
<1%

How to read these numbers

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Committed vs. ceiling: Committed is what the government has legally promised on this award so far. Contracts can also carry a ceiling — the maximum if every option is exercised. Unspent ceiling is headroom, not money owed.
Paid out: The cash actually disbursed against this award. The gap from committed is the disbursement pipeline: promised, not yet cashed.
The ledger: Each transaction is a signing event — an action that created or changed the award, dated the day it was signed — not a payment. Negative amounts are real: money de-committed at closeout or renegotiation.
The money bar: One bar, the award’s whole arithmetic: paid out, then committed, not yet paid, then .

Source

This award on USAspending.gov ↗

Federal grant · cooperative agreement (b)

Department of Energy

Advanced Research Projects Agency - Energy to