Laser Thermal Analysis, Inc

Purpose: Laser Thermal Analysis, Inc. Aims to Build a Hybrid Atomic Force Microscopy-thermoreflectance (afm-tr) Instrument to Generate Maps of the Thermal Resistance, Thermal Boundary Interface Resistance, and Temperature Profiles of Microprocessors and Wide Bandgap Semiconductor Materials and Devices With < 100 NM Spatial Resolution, < 0.5 C Temperature Resolution, < 10 Percent Measurement Uncertainty, and Capability of Characterizing Materials Without the Need for an Applied Transducer Coating. This Thermal Metrology Tool Will Be Automated, User-friendly, and Low Cost to Operate. Activities to Be Performed: the Researcher Will Demonstrate the Ability of the Instrument to Conduct Thermophysical Property Measurements and Then Will Construct and Deliver an Automated and User-friendly System. Expected Outcomes: the Instrument Will Streamline System Functionality for Ease of Operation and Lower Operational Cost, While Maximizing Measurement Throughput. Intended Beneficiaries: Researchers and the U.s. Semiconductor Industry Who Make Devices With Thermal Management Issues and Materials Development Needs on Length Scales Smaller Than 100 Nanometers.subrecipient Activities: the Recipient Plans to Subaward Funds for Activities Such as Tip Development and Coating, Data Management and Data Processing.